Date EVENT NAME TECHNOLOGY Location Event Type
06 Apr 2021 - 08 Jun 2021

CadenceTECHTALK Series: Reducing Design Cycle Time in PCB Design

How can you accelerate PCB design cycle on your next PCB design starting from accurate creation of ECAD libraries from MCAD, design with manufacturing in mind and cutting down post-layout signoff iterations? Attend the Accelerate Design Cycle series of webinars to learn the best practices in Allegro to help you master techniques that help you cut down your design cycle time.

PCB Design Online Cadence Event
21 Apr 2021 - 20 Jul 2021

CadenceTECHTALK Series: Scale Up System Simulations with Cadence Multiphysics Solvers

Join our multiphysics experts in their live sessions discussing the new generation of multiphysics solvers which are created with multi-core, cloud computing in mid with algorithms that produce virtually unlimited scalability, up to 10X performance gain and still gold standard accuracy.​

System Analysis Online Cadence Event
24 May 2021 - 28 May 2021

ETS 2021

The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, applications, hot topics and new trends in the area of electronic-based circuits and system testing, reliability, security and validation. Register to attend our "Highly Accurate and Scalable Failure Diagnosis for Large Designs with Complex DfT Architectures" talk by Sameer Chillarige​ on May 26 in the vendor session 5: Electronic Design Automation and DfT.

Modus DFT Software Solution , Automotive Online Industry Conference
25 May 2021 - 26 May 2021

PCI-SIG Virtual Developers Conference 2021

Join Cadence at PCI-SIG Developers Conference 2021 to learn about the latest developments in PCI Express technology.

Verification IP Online Industry Conference
25 May 2021

CadenceTECHTALK: 使用EMX Planar 3D Solver V6进行快速、准确和全面的电磁分析​

Join Cadence experts for a free one-hour webinar to hear the newest features of EMX Planar 3D Solver Version 6 and how it is integrated into Cadence Virtuoso® environment. Electromagnetic (EM) simulation is a critical part of modern, analog chip design. Traditional RC extraction tools typically have limitations as frequencies of operation and performance specifications are increased. Learn why Cadence EMX Planar 3D Solver is a best-in-class EM simulator for silicon chip devices.​

EMX Online Cadence Event
25 May 2021 - 28 May 2021

Embedded Vision Summit 2021

The Embedded Vision Summit attracts a global audience of companies developing computer vision and edge AI-enabled products including embedded systems, cloud solutions and mobile applications. Register for hundreds of hours of learning—from workshops to the latest technical insights, business trends and vision technologies—all with a focus on practical, deployable computer vision and visual AI. The Summit connects the theories from great academic conferences, like CVPR, to reality.

Tensilica , Tensilica Processors Online Industry Conference
26 May 2021

CadenceTECHTALK: Accelerate DFT Simulations with Xcelium Multi-Core Technology

In this webinar, Cadence experts will introduce you to the Xcelium Multi-Core Simulator and present some benchmark results. You will also learn how to qualify functional vectors using the Xcelium Single-Core Simulator and how to get started. In addition, we will share a customer experience case study.

Xcelium Online Cadence Event
26 May 2021

High Speed Digital 3D EM Forum

If you are doing high-speed design, don’t miss this half-day online forum hosted by SI Journal and featuring industry leaders Google and Microsoft. The event will cover key design topics on high-speed system designs with a keynote, “Interconnect Modeling and its Importance to HSSD Simulation” by Eric Bogatin, Professor at ECEE Univ of Colorado, Boulder, Technical Editor for SI Journal, and Teledyne LeCroy Fellow.

Cloud Portfolio, RF Microwave Design, IC Packaging and SiP Design, PCB Design, 3D-IC, Signal and Power Integrity Online Industry Conference
27 May 2021

CadenceTECHTALK: JasperGold Superlint和CDC App帮助设计者达成RTL signoff

Learn more about JasperGold Superlint App—built on the industry-leading JasperGold Formal Verification Platform—bringing best-in-class formal technology to structural lint and automatic formal checks as one integrated flow. We are looking forward to your participation.

JasperGold Online Cadence Event
27 May 2021

CadenceTECHTALK: 降低迭代次数,缩短设计闭合时间 —— Innovus设计实现系统及Tempus ECO Option

Attend this webinar to learn how the Tempus ECO Option delivers signoff accurate design closure with fewer iterations. Limited to Cadence customers with access to the digital implementation flow.

Tempus Timing Signoff Online Cadence Event